Similarly to passive_store, policy_store now is split
between thermal core data structure handling and sysfs handling.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Given that cdevs sysfs properties are already registered using
the dev.groups, there is no need to explicitly call device_remove()
for each property.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Finally, move the last thermal zone sysfs attributes to
tz->device.groups: trips attributes. This requires adding a
attribute_group to thermal_zone_device, creating it dynamically, and
then setting all trips attributes in it. The trips attribute is then
added to the tz->device.groups.
As the removal of all attributes are handled by device core, the device
remove calls are not needed anymore.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This is a patch to allow adding groups created dynamically. For now we
create only the existing group. However, this is a preparation to allow
creating trip groups, which are determined only when the number of trips
are known at runtime.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Code reorganization to keep all the sysfs I/F of a thermal zone in the
same section.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simply reorganize code to keep only functions of sysfs interface
of thermal zone device together. Therefore, move the power actor code
out of the sysfs I/F section.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simple improvement on clarity and removal of checkpatch warning
in the documentation of power actor kernel doc.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch moves the passive attribute to tz->device.groups. Moving the
passive attribute also requires a .is_visible() callback implementation
for its attribute group.
The logic behind the visibility of passive attribute is kept the same.
We only expose the passive attribute if the thermal driver has exposed
at least one passive trip point.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Moving mode attribute to tz->device.groups requires the implementation
of a .is_visible() callback. The condition returned by .is_visible() of
the mode attribute group is kept the same, we allow the attribute to be
visible only if ops->get_mode() is set by the thermal driver.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Thermal zones attributes are all being created using
device_create_file(). This has the disadvantage of making the code
complicated and sometimes we may miss the cleanup of them.
This patch starts to move the thermal zone sysfs attributes to the
dev.groups, so Linux device core manage them for us. For now, this patch
only moves those attributes are always present regardless of thermal
zone condition.
This change has also the advantage of cleaning up the thermal zone
parameters sysfs entries that are left unclean after device
registration.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simple code reorganization to group files that are always created
when registering a thermal zone.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simply reorganize the code to have all DEVICE_ATTR's
in one point in the file.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
There are APIs that rely on tz->type. This patch
prevent thermal zones without it to be registered.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Commit 3105f234e0aba43e44e277c20f9b32ee8add43d4 replaced module
cpu id table with a cpu feature check, which is logically correct.
But we need the module device table to allow module auto loading.
Cc: stable@vger.kernel.org # 4.8
Fixes:3105f234 thermal/powerclamp: correct cpu support check
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Initial logic for checking CPU match resulted in OR of CPU features
rather than the intended AND.
Updated to use boot_cpu_has macro rather than x86_match_cpu.
In addition, MWAIT is the only required CPU feature for idle
injection to work. Drop other feature requirements since they are
only needed for optimal efficiency.
CC: stable@vger.kernel.org #v4.7
Signed-off-by: Eric Ernst <eric.ernst@linux.intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
On the platforms which has an ACPI companion device associated with
PCH thermal device, read passive trip temperature via ACPI _PSV
control method.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal managament updates from Zhang Rui:
- Enhance thermal "userspace" governor to export the reason when a
thermal event is triggered and delivered to user space. From Srinivas
Pandruvada
- Introduce a single TSENS thermal driver for the different versions of
the TSENS IP that exist, on different qcom msm/apq SoCs'. Support for
msm8916, msm8960, msm8974 and msm8996 families is also added. From
Rajendra Nayak
- Introduce hardware-tracked trip points support to the device tree
thermal sensor framework. The framework supports an arbitrary number
of trip points. Whenever the current temperature is changed, the trip
points immediately below and above the current temperature are found,
driver callback is invoked to program the hardware to get notified
when either of the two trip points are triggered. Hardware-tracked
trip points support for rockchip thermal driver is also added at the
same time. From Sascha Hauer, Caesar Wang
- Introduce a new thermal driver, which enables TMU (Thermal Monitor
Unit) on QorIQ platform. From Jia Hongtao
- Introduce a new thermal driver for Maxim MAX77620. From Laxman
Dewangan
- Introduce a new thermal driver for Intel platforms using WhiskeyCove
PMIC. From Bin Gao
- Add mt2701 chip support to MTK thermal driver. From Dawei Chien
- Enhance Tegra thermal driver to enable soctherm node and set
"critical", "hot" trips, for Tegra124, Tegra132, Tegra210. From Wei
Ni
- Add resume support for tango thermal driver. From Marc Gonzalez
- several small fixes and improvements for rockchip, qcom, imx, rcar,
mtk thermal drivers and thermal core code. From Caesar Wang, Keerthy,
Rocky Hao, Wei Yongjun, Peter Robinson, Bui Duc Phuc, Axel Lin, Hugh
Kang
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (48 commits)
thermal: int3403: Process trip change notification
thermal: int340x: New Interface to read trip and notify
thermal: user_space gov: Add additional information in uevent
thermal: Enhance thermal_zone_device_update for events
arm64: tegra: set hot trips for Tegra210
arm64: tegra: set critical trips for Tegra210
arm64: tegra: add soctherm node for Tegra210
arm64: tegra: set hot trips for Tegra132
arm64: tegra: set critical trips for Tegra132
arm64: tegra: use tegra132-soctherm for Tegra132
arm: tegra: set hot trips for Tegra124
arm: tegra: set critical trips for Tegra124
thermal: tegra: add hw-throttle for Tegra132
thermal: tegra: add hw-throttle function
of: Add bindings of hw throttle for Tegra soctherm
thermal: mtk_thermal: Check return value of devm_thermal_zone_of_sensor_register
thermal: Add Mediatek thermal driver for mt2701.
dt-bindings: thermal: Add binding document for Mediatek thermal controller
thermal: max77620: Add thermal driver for reporting junction temp
thermal: max77620: Add DT binding doc for thermal driver
...
When ACPI sends notification for trip point change re-read trips and
notify thermal core, so that this can be passed to user space thermal
controller.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Separated the code for reading trip points from int340x_thermal_zone_add to
a standalone function int340x_thermal_read_trips. This standlone
interface to read is exported so that int340x drivers can re-read trips
on ACPI notification for trip point change.
Also the appropriate notification events are sent by int340x driver based
on the acpi event using int340x_thermal_zone_device_update().
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add additional properties:
NAME= Thermal zone type
TEMP= Temperature sample value
TRIP= Violated trip index
EVENT= The notification event (new temperature sample, trip violation
trip changed)
This is the additional information to what kobject_uevent already
provides. So it will not impact existing user spaces.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tegra132 use CCROC throttle registers to configure
pulse skiper, set these registers to enable throttle
function for Tegra132.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tegra soctherm support HW throttle, when the soctherm snesors'
temperature is above the throttle trip point, it will trigger
pulse skiper to tune clocks accroding to the throttle depth.
Add this function for Tegra124 and Tegra210.
Since Tegra132 use different registers to configure pulse skiper,
will support it in next patch.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
devm_thermal_zone_of_sensor_register can fail, so check it's return value.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds support for mt2701 chip to mtk_thermal,
and integrate both mt8173 and mt2701 on the same driver.
MT8173 has four banks and five sensors, and MT2701 has
only one bank and three sensors.
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
When this platform is suspended, firmware powers the entire SoC down,
except a few hardware blocks waiting for wakeup events. There is no
context to save for this particular block.
Therefore, there is nothing useful for the driver to do on suspend;
so we define a NULL suspend hook. On resume, the driver initializes
the block exactly as is done in the probe callback.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Reviewed-by: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
We could see that state is defined as unsigned type, so it
should never be less than zero. Let' remove this check.
Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
devm_thermal_zone_of_sensor_register() case doesn't need to call
thermal_zone_device_unregister().
Otherwise, rcar-thermal can't register thermal zone again after rebind.
This patch fixes it.
Signed-off-by: Bui Duc Phuc <bd-phuc@jinso.co.jp>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.
v2: drop extraneous OF
Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In case of error, the function of_iomap() returns NULL pointer
not ERR_PTR(). The IS_ERR() test in the return value check
should be replaced with NULL test.
And the function devm_regmap_init_mmio() returns ERR_PTR()
and never returns NULL. The NULL test in the return value
check should be replaced with IS_ERR().
Signed-off-by: Wei Yongjun <weiyj.lk@gmail.com>
Acked-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In less than 10 ms, the temperature of soc will arise 10 degree. 250 ms
is too big for soc tempeture control. Setting 2.5 ms will speed up
temperature accessing speed but introduce no more cpu's computing overhead.
We set AUTO_PERIOD_TIME and TSADCV3_AUTO_PERIOD_HT_TIME the same value,
because normal temperature update speed is also our consern in IPA.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Due to the voltage ripple, the sensing data of the tsadc is not accurate.
And in this patch, the bandgap feature is enhanced to remove the voltage
ripple, and then the tsadc can sense the temperature more precisely.
Obsolete codes are removed as well.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The newly added tsens-8916 driver produces warnings when CONFIG_PM
is disabled:
drivers/thermal/qcom/tsens.c:53:12: error: 'tsens_resume' defined but not used [-Werror=unused-function]
static int tsens_resume(struct device *dev)
^~~~~~~~~~~~
drivers/thermal/qcom/tsens.c:43:12: error: 'tsens_suspend' defined but not used [-Werror=unused-function]
static int tsens_suspend(struct device *dev)
^~~~~~~~~~~~~
This marks both functions __maybe_unused to let the compiler
know that they might be used in other configurations, without
adding ugly #ifdef logic.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.
It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
rcar-thermal is supporting both thermal_zone_of_sensor_register() and
thermal_zone_device_register(). But thermal_zone_of_sensor_register()
doesn't enable hwmon as default.
This patch enables it to keep compatibility
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Currently thermal zone set_emul_temp is set unconditionally
with of_thermal_set_emul_temp function. Set this only if the
set_emul_temp hook is provided for thermal_zone_of_device_ops.
This fixes emul_temp failures on platforms for which set_emul_temp
hook is not populated.
Fixes: "184a4bf623f (thermal: of: Extend current
of-thermal.c code to allow setting emulated temp)"
Suggested-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Conflicts:
drivers/thermal/of-thermal.c
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The hardware-tracked trips will set the alarm interrupt value for
registers. Then when the thermal zone has no trips to be set,
That make the thermal trips callback a over range value.
The root cause is the rk_tsadcv2_temp_to_code() function to handle the
invalid temperature range is indeed incorrect, let's fix it on now.
Otherwise, the thermal alarm interrupt will be triggered all the time
on some SoCs.
Fox example:
localhost tmp # grep thermal /proc/interrupts; sleep 5;
grep thermal /proc/interrupts
23: 994830 .. GICv3 129 Level rockchip_thermal
23: 1003423 .. GICv3 129 Level rockchip_thermal
Reported-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
We should increase the period cycles to save power since the rk3399 has
the high frequency for tsadc clock.
Fixes commit b0d70338bca22cb14
("thermal: rockchip: Support the RK3399 SoCs in thermal driver")
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Whenever the current temperature is updated, the trip points immediately
below and above the current temperature are found. A sensor driver
callback `set_trips' is then called with the temperatures.
Lastly, The sensor will trigger the hardware high temperature interrupts
to increase the sampleing rate and throttle frequency to limit the
temperature rising When performing passive cooling.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
With interrupt driven thermal zones we pass the lower and upper
temperature on which shall be acted, so in the governor we have to act on
the exact lower temperature to be consistent. Otherwise an interrupt maybe
generated on the exact lower temperature, but the bang bang governor does
not react since The polling driven zones have to be one step cooler before
the governor reacts.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
