those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.
Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.
For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).
Signed-off-by: Felipe Balbi <balbi@ti.com>
787f5627be