Add driver for the network of connects present on the SAR2130P platform.
* icc-sar2130p
dt-bindings: interconnect: qcom: document SAR2130P NoC
interconnect: qcom: add support for SAR2130P
Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add bindings for the Network of Connects (NoC) present on the
Qualcomm SAR2130P platform.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-1-c58c73dcd19d@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Document the RPMh Network-On-Chip Interconnect of the QCS615 platform.
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Link: https://lore.kernel.org/r/20240924143958.25-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Document the RPMh Network-On-Chip Interconnect of the QCS8300 platform.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Link: https://lore.kernel.org/r/20240910101013.3020-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Here is the "big" set of char/misc and other driver subsystem changes
for 6.12-rc1. Sorry for the delay, conference travel for the past two
weeks has this and my other pull requests showing up real late
in the cycle.
Lots of changes in here, primarily dominated by the usual IIO driver
updates and additions, but there are also small driver subsystem updates
all over the place. Included in here are:
- lots and lots of new IIO drivers and updates to existing ones
- interconnect subsystem updates and new drivers
- nvmem subsystem updates and new drivers
- mhi driver updates
- power supply subsystem updates
- kobj_type const work for many different small subsystems
- comedi driver fix
- coresight subsystem and driver updates
- fpga subsystem improvements
- slimbus fixups
- binder new feature addition for "frozen" notifications
- lots and lots of other small driver updates and cleanups
All of these have been in linux-next for a long time with no reported
problems.
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'char-misc-6.12-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc
Pull char / misc driver updates from Greg KH:
"Here is the "big" set of char/misc and other driver subsystem changes
for 6.12-rc1.
Lots of changes in here, primarily dominated by the usual IIO driver
updates and additions, but there are also small driver subsystem
updates all over the place. Included in here are:
- lots and lots of new IIO drivers and updates to existing ones
- interconnect subsystem updates and new drivers
- nvmem subsystem updates and new drivers
- mhi driver updates
- power supply subsystem updates
- kobj_type const work for many different small subsystems
- comedi driver fix
- coresight subsystem and driver updates
- fpga subsystem improvements
- slimbus fixups
- binder new feature addition for "frozen" notifications
- lots and lots of other small driver updates and cleanups
All of these have been in linux-next for a long time with no reported
problems"
* tag 'char-misc-6.12-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (354 commits)
greybus: gb-beagleplay: Add firmware upload API
arm64: dts: ti: k3-am625-beagleplay: Add bootloader-backdoor-gpios to cc1352p7
dt-bindings: net: ti,cc1352p7: Add bootloader-backdoor-gpios
MAINTAINERS: Update path for U-Boot environment variables YAML
nvmem: layouts: add U-Boot env layout
comedi: ni_routing: tools: Check when the file could not be opened
ocxl: Remove the unused declarations in headr file
hpet: Fix the wrong format specifier
uio: Constify struct kobj_type
cxl: Constify struct kobj_type
binder: modify the comment for binder_proc_unlock
iio: adc: axp20x_adc: add support for AXP717 ADC
dt-bindings: iio: adc: Add AXP717 compatible
iio: adc: axp20x_adc: Add adc_en1 and adc_en2 to axp_data
w1: ds2482: Drop explicit initialization of struct i2c_device_id::driver_data to 0
tools: iio: rm .*.cmd when make clean
iio: adc: standardize on formatting for id match tables
iio: proximity: aw96103: Add support for aw96103/aw96105 proximity sensor
bus: mhi: host: pci_generic: Enable EDL trigger for Foxconn modems
bus: mhi: host: pci_generic: Update EDL firmware path for Foxconn modems
...
A set of fixes that target stability of the SM8350 platform.
* icc-sm8350
interconnect: qcom: sm8350: drop DISP nodes
dt-bindings: interconnect: qcom,sm8350: drop DISP nodes
interconnect: qcom: sm8250: Enable sync_state
Link: https://lore.kernel.org/r/20240804-sm8350-fixes-v1-0-1149dd8399fe@linaro.org/
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Vendor msm-5.x kernels declared duplicate indices for some of display
nodes to be used by separate display RSC and BCM voters. As it is not
clear how this separate BCM should be modelled upstream and the device
trees do not use these indices, drop them for now.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240804-sm8350-fixes-v1-6-1149dd8399fe@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add interconnect-cells to clock provider so that it can be
used as icc provider.
Add master/slave ids for Qualcomm IPQ5332 Network-On-Chip
interfaces. This will be used by the gcc-ipq5332 driver
for providing interconnect services using the icc-clk
framework.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Link: https://lore.kernel.org/r/20240730054817.1915652-2-quic_varada@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Here is the "big" set of char/misc and other driver subsystem changes
for 6.11-rc1. Nothing major in here, just loads of new drivers and
updates. Included in here are:
- IIO api updates and new drivers added
- wait_interruptable_timeout() api cleanups for some drivers
- MODULE_DESCRIPTION() additions for loads of drivers
- parport out-of-bounds fix
- interconnect driver updates and additions
- mhi driver updates and additions
- w1 driver fixes
- binder speedups and fixes
- eeprom driver updates
- coresight driver updates
- counter driver update
- new misc driver additions
- other minor api updates
All of these, EXCEPT for the final Kconfig build fix for 32bit systems,
have been in linux-next for a while with no reported issues. The
Kconfig fixup went in 29 hours ago, so might have missed the latest
linux-next, but was acked by everyone involved.
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc
Pull char / misc and other driver updates from Greg KH:
"Here is the "big" set of char/misc and other driver subsystem changes
for 6.11-rc1. Nothing major in here, just loads of new drivers and
updates. Included in here are:
- IIO api updates and new drivers added
- wait_interruptable_timeout() api cleanups for some drivers
- MODULE_DESCRIPTION() additions for loads of drivers
- parport out-of-bounds fix
- interconnect driver updates and additions
- mhi driver updates and additions
- w1 driver fixes
- binder speedups and fixes
- eeprom driver updates
- coresight driver updates
- counter driver update
- new misc driver additions
- other minor api updates
All of these, EXCEPT for the final Kconfig build fix for 32bit
systems, have been in linux-next for a while with no reported issues.
The Kconfig fixup went in 29 hours ago, so might have missed the
latest linux-next, but was acked by everyone involved"
* tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits)
misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems
misc: delete Makefile.rej
binder: fix hang of unregistered readers
misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI
virtio: add missing MODULE_DESCRIPTION() macro
agp: uninorth: add missing MODULE_DESCRIPTION() macro
spmi: add missing MODULE_DESCRIPTION() macros
dev/parport: fix the array out-of-bounds risk
samples: configfs: add missing MODULE_DESCRIPTION() macro
misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver
misc: keba: Fix missing AUXILIARY_BUS dependency
slimbus: Fix struct and documentation alignment in stream.c
MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches
misc: fastrpc: use coherent pool for untranslated Compute Banks
misc: fastrpc: support complete DMA pool access to the DSP
misc: fastrpc: add missing MODULE_DESCRIPTION() macro
misc: fastrpc: Add missing dev_err newlines
misc: fastrpc: Use memdup_user()
nvmem: core: Implement force_ro sysfs attribute
nvmem: Use sysfs_emit() for type attribute
...
Add interconnect-cells to clock provider so that it can be
used as icc provider.
Add master/slave ids for Qualcomm IPQ9574 Network-On-Chip
interfaces. This will be used by the gcc-ipq9574 driver
that will for providing interconnect services using the
icc-clk framework.
Acked-by: Georgi Djakov <djakov@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Link: https://lore.kernel.org/r/20240430064214.2030013-3-quic_varada@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add the device-tree bindings for interconnect providers
used on MSM8953 platform.
Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add bindings for the MediaTek External Memory Interface Interconnect,
which providers support system bandwidth requirements through Dynamic
Voltage Frequency Scaling Resource Collector (DVFSRC) hardware.
This adds bindings for MediaTek MT8183 and MT8195 SoCs.
Note that this is modeled as a subnode of DVFSRC for multiple reasons:
- Some SoCs have more than one interconnect on the DVFSRC (and two
different kinds of EMI interconnect, and also a SMI interconnect);
- Some boards will want to not enable the interconnect driver because
some of those are not battery powered (so they just keep the knobs
at full thrust from the bootloader and never care scaling busses);
- Some DVFSRC interconnect features may depend on firmware.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20240610085735.147134-3-angelogioacchino.delregno@collabora.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The Qualcomm SM7150 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.
Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The downstream kernel has infrastructure for passing votes from different
interconnect nodes onto different RPMh RSCs. This neither implemented, not
is going to be implemented upstream (in favor of a different solution
using ICC tags through the same node).
Unfortunately, as it happens, meaningless (in the upstream context) parts
of the vendor driver were copied, ending up causing havoc - since all
"per-RSC" (in quotes because they all point to the main APPS one) BCMs
defined within the driver overwrite the value in RPMh on every
aggregation.
To both avoid keeping bogus code around and possibly introducing
impossible-to-track-down bugs (busses shutting down for no reason), get
rid of the duplicated ICC node definitions.
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices.
[Stephan: Drop separate mm-snoc that exists downstream since it's
actually the same NoC as SNoC in hardware]
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled
and tuned dynamically according to the bandwidth demand.
Co-developed-by: Abel Vesa <abel.vesa@linaro.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com>
Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
SM8250 (like SM8150 but unlike all other QUP-equipped SoCs) doesn't
provide a qup-core path. Adjust the bindings and drivers as necessary,
and then describe the icc paths in the device tree. This makes it possible
for interconnect sync_state succeed so long as you don't use UFS.
* icc-sm8250-qup
dt-bindings: interconnect: qcom,rpmh: Add SM8250 QUP virt
dt-bindings: interconnect: qcom,sm8250: Add QUP virt
interconnect: qcom: sm8250: Fix QUP0 nodes
Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-0-9ba0a9460be2@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The SMD RPM interconnect driver requires different icc tags to the
RPMh driver. Add bindings to reflect that.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20230526-topic-smd_icc-v7-1-09c78c175546@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
On msm8996 CBF interconnects power and performance CPU clusters. Add
corresponding interconnect defines to be used in device trees.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Tested-by: Yassine Oudjana <y.oudjana@protonmail.com>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230512001334.2983048-2-dmitry.baryshkov@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
* icc-sa8775p
dt-bindings: interconnect: qcom: document the interconnects for sa8775p
interconnect: qcom: add a driver for sa8775p
dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo
Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Commits 2f3724930eb4 ("interconnect: qcom: sc7180: Drop IP0
interconnects") and 2fb251c26560 ("interconnect: qcom: sdx55: Drop IP0
interconnects") removed IP0 interconnects (and ipa-virt devices support)
in favour of the RPMH clocks. Follow this example for other platforms
defining IP0 RPMH resource. While we are at it, remove several leftover
from the mentioned patches.
* icc-ip0-migration:
interconnect: qcom: sdx55: drop IP0 remnants
interconnect: qcom: sc7180: drop IP0 remnants
interconnect: move ignore_list out of of_count_icc_providers()
interconnect: qcom: sm8150: Drop IP0 interconnects
interconnect: qcom: sm8250: Drop IP0 interconnects
interconnect: qcom: sc8180x: Drop IP0 interconnects
interconnect: qcom: sc8280xp: Drop IP0 interconnects
dt-bindings: interconnect: qcom: Remove ipa-virt compatibles
dt-bindings: interconnect: qcom: drop IPA_CORE related defines
Link: https://lore.kernel.org/r/20230109002935.244320-1-dmitry.baryshkov@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add a DT binding document for the RPMh interconnects on Qualcomm sa8775p
platforms.
Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl
Signed-off-by: Georgi Djakov <djakov@kernel.org>
There are controllable interconnects on Snapdragon 670. Add the
compatible strings to the documentation and interconnect ID definitions.
The device tree header was generated by
linux-interconnect-driver-generator and the copyright year was changed.
Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230111005155.50452-2-mailingradian@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
These interconnects are modeled as clks, not interconnects, therefore
remove corresponding defines from the binding as they're unused.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230109002935.244320-10-dmitry.baryshkov@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add separate schema for QDU1000 and QRU1000 interconnect devices
to document the different NoCs on these platforms.
Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20221216230914.21771-2-quic_molvera@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The Qualcomm SM8550 SoC has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221202232054.2666830-2-abel.vesa@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial
value after power up is invalid, need set a valid value after related
power domain up.
This patchset also includes two patch[1,2] during my development to enable
the ICC feature for i.MX8MP.
I not include ddrc DVFS in this patchset, ths patchset is only to
support NoC value mode/priority/ext_control being set to a valid value
that suggested by i.MX Chip Design Team. The value is same as NXP
downstream one inside Arm Trusted Firmware:
https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97
Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices.
As SM6350 has two pairs of NoCs sharing the same reg, allow this in the
binding documentation, as was done for qcm2290.
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
This contains a few fixes for the sc8180x interconnect provider driver to make
it functional.
* icc-sc8180x
dt-bindings: interconnect: Add SC8180X QUP0 virt provider
interconnect: qcom: sc8180x: Modernize sc8180x probe
interconnect: qcom: sc8180x: Fix QUP0 nodes
interconnect: qcom: sc8180x: Mark some BCMs keepalive
Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The QUP0 BCM relates to some internal property of the QUPs, and should
be configured independently of the path to the QUP. In line with other
platforms expose QUP_CORE endpoints in order allow this configuration.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
The Qualcomm SC8280XP platform has the usual set of busses, add a
binding for these interconnect providers and port definitions to allow
interconnect paths to be expressed in the sc8280xp DeviceTree.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Add support for QCM2290 including a few prep changes.
* icc-qcm2290
interconnect: icc-rpm: Define ICC device type
interconnect: icc-rpm: Add QNOC type QoS support
interconnect: icc-rpm: Support child NoC device probe
dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support
interconnect: qcom: Add QCM2290 driver support
Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
