Add a thermal cooling driver to provide path to access PCIe bandwidth
controller using the usual thermal interfaces.
A cooling device is instantiated for controllable PCIe Ports from the
bwctrl service driver.
If registering the cooling device fails, allow bwctrl's probe to succeed
regardless. As cdev in that case contains IS_ERR() pseudo "pointer", clean
that up inside the probe function so the remove side doesn't need to
suddenly make an odd looking IS_ERR() check.
The thermal side state 0 means no throttling, i.e., maximum supported PCIe
Link Speed.
Link: https://lore.kernel.org/r/20241018144755.7875-9-ilpo.jarvinen@linux.intel.com
Signed-off-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com>
[bhelgaas: dropped data->cdev test per
https://lore.kernel.org/r/ZzRm1SJTwEMRsAr8@wunner.de]
Signed-off-by: Bjorn Helgaas <bhelgaas@google.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Rafael J. Wysocki <rafael@kernel.org> # From the cooling device interface perspective
Switch to thermal_of_zone to handle thermal-zones. Replace
thermal_zone_device_register() by devm_thermal_of_zone_register() and
remove ops st_thermal_get_trip_type, st_thermal_get_trip_temp.
Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com>
Link: https://lore.kernel.org/r/20240716-thermal-v4-2-947b327e165c@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Introduce a facility allowing the thermal core functionality to be
exercised in a controlled way in order to verify its behavior, without
affecting its regular users noticeably.
It is based on the idea of preparing thermal zone templates along with
their trip points by writing to files in debugfs. When ready, those
templates can be used for registering test thermal zones with the
thermal core.
The temperature of a test thermal zone created this way can be adjusted
via debugfs, which also triggers a __thermal_zone_device_update() call
for it. By manipulating the temperature of a test thermal zone, one can
check if the thermal core reacts to the changes of it as expected.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/6065927.lOV4Wx5bFT@rjwysocki.net
[ rjw: Fixed ordering of kcalloc() arguments ]
[ rjw: Fixed debugfs_create_dir() return value checks ]
[ rjw: Fixed two kerneldoc comments ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Move all Renesas thermal drivers to a vendor specific directory.
All drivers are moved verbatim apart from the updated include path for
thermal_hwmon.h.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240506154011.344324-2-niklas.soderlund+renesas@ragnatech.se
The only difference made by CONFIG_THERMAL_WRITABLE_TRIPS is whether or
not the writable trips mask passed during thermal zone registration
will take any effect, but whoever passes a non-zero writable trips mask
to thermal_zone_device_register_with_trips() can be forgiven thinking
that it will always work.
Moreover, some thermal drivers expect user space to set trip temperature
values, so they select CONFIG_THERMAL_WRITABLE_TRIPS, possibly overriding
a manual choice to unset it and going against the design purportedly
allowing system integrators to decide on the writability of trip points
for the given kernel build. It is also set in one platform's defconfig.
Forthermore, CONFIG_THERMAL_WRITABLE_TRIPS only affects trip temperature,
because trip hysteresis is writable as long as the thermal zone provides
a callback to update it, regardless of the CONFIG_THERMAL_WRITABLE_TRIPS
value.
The above means that the symbol in question is used inconsistently and
its purpose is at least moot, so remove it and always take the writable
trip mask passed to thermal_zone_device_register_with_trips() into
account.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Add debugfs-based diagnostics support to the thermal core (Daniel
Lezcano, Dan Carpenter).
- Fix a power allocator thermal governor issue preventing it from
resetting cooling devices sometimes (Di Shen).
- Simplify the thermal netlink API and clean up related code (Rafael J.
Wysocki).
- Make the Intel HFI driver support hibernation and deep suspend
properly (Ricardo Neri).
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Merge tag 'thermal-6.8-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These add support for debugfs-based diagnostics to the thermal core,
simplify the thermal netlink API, fix system-wide PM support in the
Intel HFI driver and clean up some code.
Specifics:
- Add debugfs-based diagnostics support to the thermal core (Daniel
Lezcano, Dan Carpenter)
- Fix a power allocator thermal governor issue preventing it from
resetting cooling devices sometimes (Di Shen)
- Simplify the thermal netlink API and clean up related code (Rafael
J. Wysocki)
- Make the Intel HFI driver support hibernation and deep suspend
properly (Ricardo Neri)"
* tag 'thermal-6.8-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/debugfs: Unlock on error path in thermal_debug_tz_trip_up()
thermal: intel: hfi: Add syscore callbacks for system-wide PM
thermal: gov_power_allocator: avoid inability to reset a cdev
thermal: helpers: Rearrange thermal_cdev_set_cur_state()
thermal: netlink: Rework notify API for cooling devices
thermal: core: Use kstrdup_const() during cooling device registration
thermal/debugfs: Add thermal debugfs information for mitigation episodes
thermal/debugfs: Add thermal cooling device debugfs information
thermal: netlink: Pass thermal zone pointer to notify routines
thermal: netlink: Drop thermal_notify_tz_trip_add/delete()
thermal: netlink: Pass pointers to thermal_notify_tz_trip_up/down()
thermal: netlink: Pass pointers to thermal_notify_tz_trip_change()
The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.
The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.
The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:
thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table
The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:
Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).
It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.
Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn>
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn
For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.
The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Since commit 0166dc11be ("of: make CONFIG_OF user selectable"), it
is possible to test-build any driver which depends on OF on any
architecture by explicitly selecting OF. Therefore depending on
COMPILE_TEST as an alternative is no longer needed.
It is actually better to always build such drivers with OF enabled,
so that the test builds are closer to how each driver will actually be
built on its intended target. Building them without OF may not test
much as the compiler will optimize out potentially large parts of the
code. In the worst case, this could even pop false positive warnings.
Dropping COMPILE_TEST here improves the quality of our testing and
avoids wasting time on non-existent issues.
Signed-off-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The userspace governor is still in use on production systems and the
deprecating warning is scary.
Even if we want to get rid of the userspace governor, it is too soon
yet as the alternatives are not yet adopted.
Change the deprecated warning by an information message suggesting to
switch to the netlink thermal events.
Fixes: 0275c9fb0e ("thermal/core: Make the userspace governor deprecated")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.
The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.
The TSU has no interrupts as well as no external pins.
This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The zte zx platform is getting removed, so this driver is no
longer needed.
Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
The tango platform is getting removed, so the driver is no
longer needed.
Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
- Make better attempt at matching device with the correct OF node
- Allow batch removal of hierarchical sub-devices
- New Drivers
- Add STM32 Clocksource driver
- Add support for Khadas System Control Microcontroller
- Driver Removal
- Remove unused driver for TI's SMSC ECE1099
- New Device Support
- Add support for Intel Emmitsburg PCH to Intel LPSS PCI
- Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
- Add support for Dialog DA revision to Dialog DA9063
- New Functionality
- Add support for AXP803 to be probed by I2C
- Fix-ups
- Numerous W=1 warning fixes
- Device Tree changes; stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller
- Enabled Regmap 'fast I/O'; stm32-lptimer
- Change BUG_ON to WARN_ON; arizona-core
- Remove superfluous code/initialisation; madera, max14577
- Trivial formatting/spelling issues; madera-core, madera-i2c, da9055, max77693-private
- Switch to of_platform_populate(); sprd-sc27xx-spi
- Expand out set/get brightness/pwm macros; lm3533-ctrlbank
- Disable IRQs on suspend; motorola-cpcap
- Clean-up error handling; intel_soc_pmic_mrfld
- Ensure correct removal order of sub-devices; madera
- Many s/HTTP/HTTPS/ link changes
- Ensure name used with Regmap is unique; syscon
- Bug Fixes
- Properly 'put' clock on unbind and error; arizona-core
- Fix revision handling; da9063
- Fix 'assignment of read-only location' error; kempld-core
- Avoid using the Regmap API when atomic; rn5t618
- Redefine volatile register description; rn5t618
- Use locking to protect event handler; dln2
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Merge tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
"Core Frameworks
- Make better attempt at matching device with the correct OF node
- Allow batch removal of hierarchical sub-devices
New Drivers
- Add STM32 Clocksource driver
- Add support for Khadas System Control Microcontroller
Driver Removal
- Remove unused driver for TI's SMSC ECE1099
New Device Support
- Add support for Intel Emmitsburg PCH to Intel LPSS PCI
- Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
- Add support for Dialog DA revision to Dialog DA9063
New Functionality
- Add support for AXP803 to be probed by I2C
Fix-ups
- Numerous W=1 warning fixes
- Device Tree changes (stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller)
- Enabled Regmap 'fast I/O' in stm32-lptimer
- Change BUG_ON to WARN_ON in arizona-core
- Remove superfluous code/initialisation (madera, max14577)
- Trivial formatting/spelling issues (madera-core, madera-i2c, da9055, max77693-private)
- Switch to of_platform_populate() in sprd-sc27xx-spi
- Expand out set/get brightness/pwm macros in lm3533-ctrlbank
- Disable IRQs on suspend in motorola-cpcap
- Clean-up error handling in intel_soc_pmic_mrfld
- Ensure correct removal order of sub-devices in madera
- Many s/HTTP/HTTPS/ link changes
- Ensure name used with Regmap is unique in syscon
Bug Fixes
- Properly 'put' clock on unbind and error in arizona-core
- Fix revision handling in da9063
- Fix 'assignment of read-only location' error in kempld-core
- Avoid using the Regmap API when atomic in rn5t618
- Redefine volatile register description in rn5t618
- Use locking to protect event handler in dln2"
* tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (76 commits)
mfd: syscon: Use a unique name with regmap_config
mfd: Replace HTTP links with HTTPS ones
mfd: dln2: Run event handler loop under spinlock
mfd: madera: Improve handling of regulator unbinding
mfd: mfd-core: Add mechanism for removal of a subset of children
mfd: intel_soc_pmic_mrfld: Simplify the return expression of intel_scu_ipc_dev_iowrite8()
mfd: max14577: Remove redundant initialization of variable current_bits
mfd: rn5t618: Fix caching of battery related registers
mfd: max77693-private: Drop a duplicated word
mfd: da9055: pdata.h: Drop a duplicated word
mfd: rn5t618: Make restart handler atomic safe
mfd: kempld-core: Fix 'assignment of read-only location' error
mfd: axp20x: Allow the AXP803 to be probed by I2C
mfd: da9063: Add support for latest DA silicon revision
mfd: da9063: Fix revision handling to correctly select reg tables
dt-bindings: mfd: st,stmfx: Remove I2C unit name
dt-bindings: mfd: ti,j721e-system-controller.yaml: Add J721e system controller
mfd: motorola-cpcap: Disable interrupt for suspend
mfd: smsc-ece1099: Remove driver
mfd: core: Add OF_MFD_CELL_REG() helper
...
We just don't do that. "default y" is for things that are needed for
compatibility (when an old feature is made unconditional), or for things
that are basically part of the infrastructure of a platform.
And it can possibly be used for questions that don't enable code on
their own, but are used to enable or disable a whole slew of other
questions.
A new feature that people aren't using is never 'default y', unless it
cures cancer or ends world hunger.
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.
Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.
As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.
Reported-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.
This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC
and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies
to the QORIQ_THERMAL config symbol, to avoid asking the user about it
when configuring a kernel without support for any of the aforementioned
SoCs.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Li Yang <leoyang.li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
Qoriq thermal driver is used by both PowerPC and ARM architecture.
When built for PowerPC architecture, it reports error:
undefined reference to `.__devm_regmap_init_mmio_clk'
To fix it, select config REGMAP_MMIO.
Fixes: 4316237bd6 (thermal: qoriq: Convert driver to use regmap API)
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200303084641.35687-1-andy.tang@nxp.com
i.MX SCU thermal driver depends on IMX_SCU which does NOT have
COMPILE_TEST enabled, so need to remove COMPILE_TEST for i.MX
SCU thermal as well.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583222684-10229-2-git-send-email-Anson.Huang@nxp.com
The thermal subsystem may have relied on sysfs in 2008 when it
was introduced, but these days the thermal zones will more often
than not come from the hardware descriptions and not from sysfs.
Drop the "Generic" phrases as well: there are no non-generic
drivers that I know of, the thermal framework is by definition
generic.
Reword a bit and fix some grammar.
[ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..
This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
This patch adds the support for Spreadtrum thermal sensor controller,
which can support maximum 8 sensors.
Signed-off-by: Freeman Liu <freeman.liu@unisoc.com>
Co-developed-with: Baolin Wang <baolin.wang@unisoc.com>
Signed-off-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.
It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.
The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.
An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.
With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.
There is no functional changes.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
When do randbuiding, we got this:
WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR
Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n]
Selected by [y]:
- THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && <choice>
The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the
THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL
which is not enabled.
Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR
to fix this warning.
Suggested-by: Quentin Perret <qperret@google.com>
Fixes: a4e893e802 ("thermal: cpu_cooling: Migrate to using the EM framework")
Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com
The newly introduced Energy Model framework manages power cost tables in
a generic way. Moreover, it supports several types of models since the
tables can come from DT or firmware (through SCMI) for example. On the
other hand, the cpu_cooling subsystem manages its own power cost tables
using only DT data.
In order to avoid the duplication of data in the kernel, and in order to
enable IPA with EMs coming from more than just DT, remove the private
tables from cpu_cooling.c and migrate it to using the centralized EM
framework. Doing so should have no visible functional impact for
existing users of IPA since:
- recent extenstions to the the PM_OPP infrastructure enable the
registration of EMs in PM_EM using the DT property used by IPA;
- the existing upstream cpufreq drivers marked with the
'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP
infrastructure, which means they all support PM_EM. The only two
exceptions are qoriq-cpufreq which doesn't in fact use an EM and
scmi-cpufreq which doesn't use DT for power costs.
For existing users of cpu_cooling, PM_EM tables will contain the exact
same power values that IPA used to compute on its own until now. The
only new dependency for them is to compile in CONFIG_ENERGY_MODEL.
The case where the thermal subsystem is used without an Energy Model
(cpufreq_cooling_ops) is handled by looking directly at CPUFreq's
frequency table which is already a dependency for cpu_cooling.c anyway.
Since the thermal framework expects the cooling states in a particular
order, bail out whenever the CPUFreq table is unsorted, since that is
fairly uncommon in general, and there are currently no users of
cpu_cooling for this use-case.
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Quentin Perret <qperret@google.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com
Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).
The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.
Implement reading the temperature from each thermal sensor.
The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
At some point there was an attempt to convert the DB8500
thermal sensor to device tree: a probe path was added
and the device tree was augmented for the Snowball board.
The switchover was never completed: instead the thermal
devices came from from the PRCMU MFD device and the probe
on the Snowball was confused as another set of configuration
appeared from the device tree.
Move over to a device-tree only approach, as we fixed up
the device trees.
Cc: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Pull thermal management updates from Zhang Rui:
- Remove the 'module' Kconfig option for thermal subsystem framework
because the thermal framework are required to be ready as early as
possible to avoid overheat at boot time (Daniel Lezcano)
- Fix a bug that thermal framework pokes disabled thermal zones upon
resume (Wei Wang)
- A couple of cleanups and trivial fixes on int340x thermal drivers
(Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
drivers: thermal: processor_thermal: Downgrade error message
mlxsw: Remove obsolete dependency on THERMAL=m
hwmon/drivers/core: Simplify complex dependency
thermal/drivers/core: Fix typo in the option name
thermal/drivers/core: Remove depends on THERMAL in Kconfig
thermal/drivers/core: Remove module unload code
thermal/drivers/core: Remove the module Kconfig's option
thermal: core: skip update disabled thermal zones after suspend
thermal: make device_register's type argument const
thermal: intel: int340x: processor_thermal_device: simplify to get driver data
thermal/int3403_thermal: favor _TMP instead of PTYP
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:
drivers/thermal/thermal_mmio.o:
In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1):
undefined reference to `devm_ioremap_resource'
The users of devm_ioremap_resource() which are compile-testable
should depend on HAS_IOMEM.
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Talel Shenhar <talel@amazon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.
This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.
Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Unlike the other options, the cpu cooling option is beginning
with a lowercase letter, changing to a uppercase.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The dependency on the THERMAL option to be set is already there implicitly
by the "if THERMAL" conditionnal option. The sub Kconfigs do not have to
check against the THERMAL option as they are called from a Kconfig block
which is enabled by the conditionnal option.
Remove the useless "depends on THERMAL" in the Kconfigs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The module support for the thermal subsystem makes little sense:
- some subsystems relying on it are not modules, thus forcing the
framework to be compiled in
- it is compiled in for almost every configs, the remaining ones
are a few platforms where I don't see why we can not switch the thermal
to 'y'. The drivers can stay in tristate.
- platforms need the thermal to be ready as soon as possible at boot time
in order to mitigate
Usually the subsystems framework are compiled-in and the plugs are as
module.
Remove the module option. The removal of the module related dead code will
come after this patch gets in or is acked.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <groeck@chromium.org>
For mini2440:
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Paul Burton <paul.burton@mips.com> # MIPS part
Acked-by: Robert Jarzmik <robert.jarzmik@free.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal soc updates from Eduardo Valentin:
"Specifics:
- mediatek thermal now supports MT8183
- broadcom thermal now supports Stingray
- qoirq now supports multiple sensors
- fixes on different drivers: rcar, tsens, tegra
Some new drivers are still pending further review and I chose to leave
them for the next merge window while still sending this material"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: rcar_gen3_thermal: Register hwmon sysfs interface
thermal/qcom/tsens-common : fix possible object reference leak
thermal: tegra: add get_trend ops
thermal: tegra: fix memory allocation
thermal: tegra: remove unnecessary warnings
thermal: mediatek: add support for MT8183
dt-bindings: thermal: add binding document for mt8183 thermal controller
thermal: mediatek: add flag for bank selection
thermal: mediatek: add thermal controller offset
thermal: mediatek: add calibration item
thermal: mediatek: add common index of vts settings.
thermal: mediatek: fix register index error
thermal: qoriq: add multiple sensors support
thermal: broadcom: Add Stingray thermal driver
dt-bindings: thermal: Add binding document for SR thermal
Stingray SoC has six temperature sensor and those are
configured, controlled and accessed to read temperature
and update in DDR memory using m0 firmware.
All six sensors has been given 4 bytes of memory in DDR
to write temperature in millivolts.
This thermal driver read temperature values from DDR
because no direct access to sensors.
Like this all temparature sensors are monitored and
trips at critical temperature.
If driver can't handle thermal runaways because of
any unknown reason, then firmware in m0 Processor
will handle.
Reviewed-by: Ray Jui <ray.jui@broadcom.com>
Reviewed-by: Scott Branden <scott.branden@broadcom.com>
Reviewed-by: Vikram Prakash <vikram.prakash@broadcom.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com>
Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The CPU cooling driver (cpu_cooling.c) allows the platform's cpufreq
driver to register as a cooling device and cool down the platform by
throttling the CPU frequency. In order to be able to auto-register a
cpufreq driver as a cooling device from the cpufreq core, we need access
to code inside cpu_cooling.c which, in turn, accesses code inside
thermal core.
CPU_FREQ is a bool while THERMAL is tristate. In some configurations
(e.g. allmodconfig), CONFIG_THERMAL ends up as a module while
CONFIG_CPU_FREQ is compiled in. This leads to following error:
drivers/cpufreq/cpufreq.o: In function `cpufreq_offline':
cpufreq.c:(.text+0x407c): undefined reference to `cpufreq_cooling_unregister'
drivers/cpufreq/cpufreq.o: In function `cpufreq_online':
cpufreq.c:(.text+0x70c0): undefined reference to `of_cpufreq_cooling_register'
Given that platforms using CPU_THERMAL usually want it compiled-in so it
is available early in boot, make CPU_THERMAL depend on THERMAL being
compiled-in instead of allowing it to be a module.
As a result of this change, get rid of the ugly (!CPU_THERMAL ||
THERMAL) dependency in all cpufreq drivers using CPU_THERMAL.
Suggested-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Pull thermal management updates from Zhang Rui:
- Add locking for cooling device sysfs attribute in case the cooling
device state is changed by userspace and thermal framework
simultaneously. (Thara Gopinath)
- Fix a problem that passive cooling is reset improperly after system
suspend/resume. (Wei Wang)
- Cleanup the driver/thermal/ directory by moving intel and qcom
platform specific drivers to platform specific sub-directories. (Amit
Kucheria)
- Some trivial cleanups. (Lukasz Luba, Wolfram Sang)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal/intel: fixup for Kconfig string parsing tightening up
drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir
drivers: thermal: Move various drivers for intel platforms into a subdir
thermal: Fix locking in cooling device sysfs update cur_state
Thermal: do not clear passive state during system sleep
thermal: zx2967_thermal: simplify getting .driver_data
thermal: st: st_thermal: simplify getting .driver_data
thermal: spear_thermal: simplify getting .driver_data
thermal: rockchip_thermal: simplify getting .driver_data
thermal: int340x_thermal: int3400_thermal: simplify getting .driver_data
thermal: remove unused function parameter
